CAIG No Clean Soldering Flux RSF-R39-2, 56g Jar

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CAIG No Clean Soldering Flux, 56g Jar

RSF-R39 Rosin No Clean Flux is a mildly activated rosin flux that is considerably more active than water-white rosin.

  • Recommended for electrical and electronic soldering applications
  • Excellent for P.C.B repair and rework
  • No refrigeration necessary
  • Can be safely left on the circuit board after reflow without cleaning

***See More Info Under the Specifications Tab***

  • Appearance: Smooth and tacky amber paste
  • Viscosity (Malcom): Typically 200 – 280 at 5 rpm @ 25 C
  • Tack strength (per IPC J-STD-004):
  • Initial TBD 6 hr @ 50%RH TBD 24 hr @ 50%RH TBD Fineness of Grind < 10 micrometer Acid Number (mg KOH/g) 90-110
  • Halide content ROL0, per IPC J-STD-004, Halide free
  • Halogen content None intentionally added
  • IPC SIR J-STD-004B Pass
  • Bellcore SIR (pass > 1011) Pass, 8.9X109, Ohms at 96 hours 2.2X1010 at 500 hours Pass/Fail = final > initial/10)
  • Shelf life of unopened containers is nominally 12 months. If the material has been chilled, the container should be allowed to reach room temperature
  • Nonflammable, noncorrosive.
  • Formulation:
    • 50-60% WW Gum Rosin
    • 40-50% Proprietary ingredients
  • RoHS Compliant: YES
  • VOC Compliant: YES

Residue Removal:

  •  In applications requiring cleaning, RSF-R80 ­ux residues can be readily removed using an aqueous saponi‑er cleaning process. Can be removed by wiping with a cloth or with cleaning solvent.


  • RSF-R80 is not considered toxic; however, its use in typical soldering processes will generate a small amount of decomposition and reaction product fumes. These fumes must be adequately exhausted for operator safety and comfort.
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