Caig HSC67 Silicone Heat Sink Compound

HSC67 Silicone Heat Sink Compound

Heat Sink Compound, silicone-based, jar, 6.0 grams

Transfer Heat Away from Electronic Components and Parts

Thermally conductive compounds are grease-like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed, and high-temperature stability. These compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e., heat sink).

USE:

• Apply to all mounting and threaded surfaces of the device and chassis.

CONTAINS:

• Zinc oxide and polydimethyl siloxane.

Transfer heat away from:

• Heat Sinks
• Transistors
• Power Diodes
• Semi-Conductors Ballast’s
• Thermocouple Wells

Specifications:

• Thermal Conductivity: 0.67 Watts per meter K
• Specific Gravity: 2.1 @25°C
• Composition: Silicone and Zinc Oxides
• Viscosity: 542000 mPa.s
• Shelf Life: 60 months